Technomelt PA 6818

Apple**胶 TECHNOMELT 6818


PRODUCT DESCRIPTION
Technomelt PA 6818 provides the following product characteristics:
Technology : Polyamide
Product Type : Hotmelt
Cure : Physical setting
Condition : Thermoplastic
Components : One component
Application : General assembly
Appearance : Amber


Application Areas:
Technomelt PA 6818 is used for molding application. It has
high softening point and suitable for porous substrates such as
paper, wood and leather.


Technical Data:
Softening point : 206~216℃
Melting Viscosity at 235℃, mPas : 4000~7500
Elongation, % : 300


Application:
Application Temperature: 225 to 240℃
Application System: Hotmelt application systems


When bonding to a substrate with high thermal conductivity the use of a specific application temperature is required for good wetting.


Do not heat the product above the specified application
temperature range.
When the product is not in use do not apply heat, this will degrade the quality of the product and in extreme cases cause carbonisation. The standby temperature for the product is approximately 50℃ below the application temperature, but not for longer than 72 hours.


Technomelt PA 6818 may absorb moisture from the air. This will not be apparent in the solid form, but may cause bubbles on heating and could affect the bond quality. It is important, therefore, that containers are kept closed and sealed when not in use.